Bond Connect Company Limited ("BCCL") has established an electronic platform to facilitate and process the submission of applications and supporting documents through the internet for the purposes of admitting to the Bond Connect Scheme ("Bond Connect"), i.e. the E-filing System (the "E-filing System").
You are about to access and enter into the E-filing System for the aforementioned purposes. Please read the following terms and conditions carefully. Unless otherwise stated, all the definitions in the Access Rules of Bond Connect will apply to these terms and conditions. By using the E-filing System, you agree to be bound by these terms and conditions which incorporate the Personal Information Collection Statement concerning the onboarding application for Bond Connect.